Tuesday, March 25, 2014

Internship – VLSI (Technology) – Intel Corporation (posted on 25 MAR 2014)

Company
Intel Corporation
Industry
Technology
Location
Singapore
Position Type
Internship
Post Date
25 March 2014
Closing Date
01 August 2014

Employer Description
Intel, the world leader in silicon innovation, develops technologies, products, and initiatives to continually advance how people work and live. Founded in 1968 to build semiconductor memory products, Intel introduced the world's first microprocessor in 1971.

Intel was an early developer of SRAM and DRAM memory chips, and this represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business. During the 1990s, Intel invested heavily in new microprocessor designs fostering the rapid growth of the computer industry. During this period Intel became the dominant supplier of microprocessors for PCs, and was known for aggressive and sometimes illegal tactics in defense of its market position, particularly against Advanced Micro Devices (AMD), as well as a struggle with Microsoft for control over the direction of the PC industry.

The 2013 rankings of the world's 100 most valuable brands published by Millward Brown Optimor showed the company's brand value at number 61.

Responsibilities
Design of Behavioural functional model (VIP) with System verilog, eVC and System C

Design of Bus monitors, Agent and sequencer and auto checking mechanism in an OVM environment

Create and build test cases to verify Device Under Test from Objective and standard specification

Qualifications
Previous development experience in one or more of these areas: GPS, NFC, BT,FM, WLAN together with SoC/ARM/AHB bus design is a strong added advantage.
Experience in UPF/CPF power intent file is essential
Expert knowledge of VHDL/Verilog and CAD simulation tools (Cadence and/or Synopsys)
Experience through IC life cycle from conception, design, verification, tapeout and silicon validation

Application link

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